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CMP Slurry - メーカー・企業9社の製品一覧とランキング

更新日： 集計期間:Nov 05, 2025～Dec 02, 2025
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CMP Slurryのメーカー・企業ランキング

更新日： 集計期間:Nov 05, 2025～Dec 02, 2025
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  1. TOPPANインフォメディア Tokyo//others
  2. MFCテクノロジー Saitama//Other manufacturing
  3. ピュアオンジャパン Kanagawa//Chemical
  4. 4 null/null
  5. 5 アンカーテクノ Nara//Trading company/Wholesale
企業ランキングへ

CMP Slurryの製品ランキング

更新日： 集計期間:Nov 05, 2025～Dec 02, 2025
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  1. CMP slurry (chemical mechanical polishing liquid abrasive) TOPPANインフォメディア
  2. Recycled CMP slurry MFCテクノロジー
  3. Pre-CMP slurry: Reducing CMP process time ピュアオンジャパン
  4. 4 2025-2026 Edition: Current Status and Future Outlook of CMP Slurries for Semiconductors
  5. 5 CMP slurry for oxidation film engineering "ILD(TM) Series" アンカーテクノ

CMP Slurryの製品一覧

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CMP slurry

CMP slurry

Widely customizable CMP slurry

CMP (Chemical Mechanical Polishing) slurry is used in the semiconductor manufacturing process to polish the surface of substrates. Chemical etching softens the material, and mechanical abrasion removes the material, resulting in the flattening of the original three-dimensional shape. This is the mechanism of CMP. Our CMP slurry has a proven track record for various applications, including copper wiring for semiconductor circuit miniaturization and speed enhancement, low-temperature sputtering for cost-effective aluminum wiring, and compounds that excel in high-speed signal processing. It is composed of a chemical reaction solution and nano-sized polishing particles, characterized by minimal generation of coarse particles and sedimentation, ensuring stable quality. *Please feel free to contact us.*

  • Wafer processing/polishing equipment

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CMP slurry

CMP slurry

CMP slurry

Features ◆ Uniform particle size (sharp particle size distribution, spherical particles). ◆ High efficiency (unique formulation, stable pH). ◆ High flatness (surface quality: Ra < 0.2 nm, TTV < 3 μm). ◆ High number of circulation uses. ◆ Capable of low-temperature polishing (below 35°C). ◆ We offer a specially formulated slurry for processing SIC wafers. ◆ Neutral and weakly acidic slurries are available for aluminum nitride processing.

  • Other abrasives
  • Other consumables

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Pre-CMP slurry: Reducing CMP process time

Pre-CMP slurry: Reducing CMP process time

Softly controlling the hard! A slurry for polishing hard substrates blended with silica and diamond. By using it before CMP, it shortens the process time.

This is a recommended pre-CPM slurry for polishing hard materials such as sapphire, SiC, and silicon nitride. By using it before CMP, you can shorten the CMP process time. 【Recommended for the following situations】 ■ Those who want to shorten the CMP process time ■ Those who want to efficiently remove fine scratches, etc. ■ Those who want to reduce the load of potassium permanganate slurry *For more details, please feel free to contact us.

  • ULTRA-SOL_5gal.jpg
  • ULTRA-SOL_55gal.jpg
  • ULTRA-SOL_range_003.jpg
  • Other abrasives

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CMP slurry

CMP slurry

CMP slurry

CMP slurry is a silica slurry optimized specifically for polishing processes of materials such as sapphire, SiC wafers, aluminum nitride, ceramics, and metals. It has excellent particle size uniformity, high dispersion stability, and produces a uniform and good finishing surface.

  • others

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CMP slurry (chemical mechanical polishing liquid abrasive)

CMP slurry (chemical mechanical polishing liquid abrasive)

We can provide CMP slurries that meet customer needs for the flattening of semiconductor substrates with mixed materials.

Our company develops and manufactures CMP slurries. CMP stands for Chemical Mechanical Polishing, which involves mechanical removal and polishing while chemically dissolving materials. The chemical actions applied depend on the chemical properties of the material to be removed. The CMP slurry for semiconductor copper wiring is mass-produced for advanced devices and has gained high trust as it has been certified as a partner by major electronics manufacturers. We are also advancing the development of CMP slurries for cutting-edge devices. [Our company offers contract manufacturing of various slurries and coatings] If you have any issues with manufacturing, please feel free to contact us.

  • Other semiconductors

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Recycled CMP slurry

Recycled CMP slurry

Did you know that CMP slurry can be regenerated as CMP slurry?

Did you know that CMP slurry can be regenerated as CMP slurry? The water that is separated during regeneration is ultra-pure water originally used in the factory, and it can be recovered and reused as raw water for ultra-pure water production. If you are having trouble with CMP slurry recycling or the treatment of wastewater containing CMP slurry, please feel free to consult us.

  • Ceramics
  • Other semiconductors

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CMP slurry for oxidation film engineering "ILD(TM) Series"

CMP slurry for oxidation film engineering "ILD(TM) Series"

Fumed silica slurry for oxidation film engineering

The "ILD(TM) Series" is a CMP slurry for oxide films that uses fumed silica. It is an industry-standard slurry that achieves a high polishing rate and reduces scratches and impurities, which is difficult to achieve with conventional colloidal silica slurries, and can also be used for glass-epoxy polishing. [Overview] - Suitable for oxide film process polishing requiring low scratch performance - KOH/ammonia-based - Overwhelming reduction of metallic impurities - High mechanical polishing characteristics *For more details, please download the PDF or feel free to contact us.

  • Other abrasives

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Important Material Report: CMP Slurry and Pad Market 2025-2026

Important Material Report: CMP Slurry and Pad Market 2025-2026

The CMP market revenue is projected to reach 3.6 billion dollars by 2025! Covering CMP consumables and supply chains for semiconductor device manufacturing!

CMP slurries and pads are extremely important in semiconductor manufacturing. This is because process integration requires the production of thin, uniform planar layers to build device structures across the entire semiconductor wafer. The number of steps in the CMP process continues to increase with each new generation of device technology. New device technologies are characterized by more layers, new materials, stricter process control requirements, and new techniques for advanced packaging. These manufacturing challenges necessitate the development of new CMP slurries and pads. Techcet's market research report "CMP Slurry and Pad Market Report CMR 2025-2026" examines market drivers, forecasts by application for slurries and pads, market share, and abrasive suppliers, with a particular focus on advanced packaging. *For more details on the report, please see the following URL:* https://www.dri.co.jp/auto/report/techcet/techccmpcons.html

  • CMP Equipment

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CMP slurry

CMP slurry

Stable quality is a characteristic! Introducing the properties of "alumina" and "silica" as well as the polishing targets!

Our company conducts slurry development and manufacturing based on the experience we have cultivated since our founding. "CMP slurry" is composed of chemical solutions and nano-sized abrasive particles, characterized by minimal generation of coarse particles and good particle dispersion, ensuring stable quality. We offer "alumina," which provides excellent cleaning properties and a fast polishing rate, and "silica," which achieves damage-free results with high surface roughness. 【Features】 <Alumina> ■ Properties: Excellent cleaning properties and fast polishing rate ■ Polishing targets: Resins, compound ceramics <Silica> ■ Properties: Damage-free with high surface roughness ■ Polishing targets: Oxide films, metal film resins, glass *For more details, please refer to the PDF document or feel free to contact us.

  • Other abrasives

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[Research Material] Global Market for CMP Polishing Materials

[Research Material] Global Market for CMP Polishing Materials

Global Market for CMP Polishing Materials: CMP Slurries, CMP Pads, CMP Pad Conditioners, CMP Slurry Filters, PVA ...

This research report (Global CMP Polishing Materials Market) investigates and analyzes the current state of the global market for CMP polishing materials and its outlook for the next five years. It includes information on the overview of the global CMP polishing materials market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the CMP polishing materials market include CMP slurries, CMP pads, CMP pad conditioners, CMP slurry filters, PVA brushes, retaining rings, and CMP post-cleaning, while the segments by application focus on 300mm wafers, 200mm wafers, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size for CMP polishing materials. It also includes the market share of major companies in CMP polishing materials, product and business overviews, and sales performance.

  • Other services

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